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? semiconductor components industries, llc, 2010 march, 2010 ? rev. 6 1 publication order number: mc74hc4040a/d mc74hc4040a 12-stage binary ripple counter high ? performance silicon ? gate cmos the mc74c4040a is identical in pinout to the standard cmos mc14040. the device inputs are compatible with standard cmos outputs; with pullup resistors, they are compatible with lsttl outputs. this device consists of 12 master ? slave flip ? flops. the output of each flip ? flop feeds the next and the frequency at each output is half of that of the preceding one. the state counter advances on the negative ? going edge of the clock input. reset is asynchronous and active ? high. state changes of the q outputs do not occur simultaneously because of internal ripple delays. therefore, decoded output signals are subject to decoding spikes and may have to be gated with the clock of the hc4040a for some designs. features ? output drive capability: 10 lsttl loads ? outputs directly interface to cmos, nmos, and ttl ? operating voltage range: 2.0 to 6.0 v ? low input current: 1 a ? high noise immunity characteristic of cmos devices ? in compliance with jedec standard no. 7a requirements ? chip complexity: 398 fets or 99.5 equivalent gates ? pb ? free packages are available* *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. http://onsemi.com marking diagrams soic ? 16 d suffix case 751b tssop ? 16 dt suffix case 948f 1 16 pdip ? 16 n suffix case 648 1 16 1 16 1 16 mc74hc4040an awlyywwg 1 16 hc4040ag awlyww hc40 40a alyw 1 16 a = assembly location l, wl = wafer lot y, yy = year w, ww = work week g = pb ? free package = pb ? free package (note: microdot may be in either location) see detailed ordering and shipping information in the package dimensions sect ion on page 2 of this data sheet. ordering information 1 16 74hc4040a alywg soeiaj ? 16 f suffix case 966 1 16
mc74hc4040a http://onsemi.com 2 figure 1. logic diagram q1 9 q2 7 q3 6 q4 5 q5 3 q6 2 q7 4 q8 13 q9 12 q10 14 clock 10 reset 11 pin 16 = v cc pin 8 = gnd 15 16 14 13 12 11 10 2 1 34567 v cc 9 8 q11 q10 q8 q9 reset clock q1 q12 q6 q5 q7 q4 q3 q2 gnd figure 2. pinout: 16 ? lead plastic package (top view) q11 15 q12 1 function table clock reset output state x l l h no charge advance to next state all outputs are low ordering information device package shipping ? mc74hc4040an pdip ? 16 2000 units / box mc74hc4040ang pdip ? 16 (pb ? free) 2000 units / box mc74hc4040ad soic ? 16 48 units / rail mc74hc4040adg soic ? 16 (pb ? free) 48 units / rail mc74hc4040adr2 soic ? 16 2500 units / reel mc74hc4040adr2g soic ? 16 (pb ? free) 2500 units / reel mc74hc4040adtr2 tssop ? 16* 2500 units / reel mc74hc4040adtr2g tssop ? 16* 2500 units / reel mc74hc4040af soeiaj ? 16 50 units / rail mc74hc4040afg soeiaj ? 16 (pb ? free) 50 units / rail mc74hc4040afel soeiaj ? 16 2000 units / reel MC74HC4040AFELG soeiaj ? 16 (pb ? free) 2000 units / reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *this package is inherently pb ? free.
mc74hc4040a http://onsemi.com 3 maximum ratings symbol parameter value unit v cc dc supply voltage (referenced to gnd) ? 0.5 to + 7.0 v v in dc input voltage (referenced to gnd) ? 0.5 to v cc + 0.5 v v out dc output voltage (referenced to gnd) ? 0.5 to v cc + 0.5 v i in dc input current, per pin 20 ma i out dc output current, per pin 25 ma i cc dc supply current, v cc and gnd pins 50 ma p d power dissipation in still air, plastic dip? soic package? tssop package? 750 500 450 mw t stg storage temperature range ? 65 to + 150 c t l lead temperature, 1 mm from case for 10 seconds plastic dip, soic or tssop package 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended oper ating conditions may affect device reliability. ?derating ? plastic dip: ? 10 mw/ c from 65 to 125 c soic package: ? 7 mw/ c from 65 to 125 c tssop package: ? 6.1 mw/ c from 65 to 125 c recommended operating conditions symbol parameter min max unit v cc dc supply voltage (referenced to gnd) 2.0 6.0 v v in , v out dc input voltage, output voltage (referenced to gnd) 0 v cc v t a operating temperature range, all package types ? 55 + 125 c t r , t f input rise and fall time v cc = 2.0 v (figure 1) v cc = 3.0 v v cc = 4.5 v v cc = 6.0 v 0 0 0 0 1000 600 500 400 ns dc characteristics (voltages referenced to gnd) symbol parameter condition v cc v guaranteed limit unit ? 55 to 25 c 85 c 125 c v ih minimum high ? level input voltage v out = 0.1v or v cc ? 0.1v |i out | 20 a 2.0 3.0 4.5 6.0 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 1.50 2.10 3.15 4.20 v v il maximum low ? level input voltage v out = 0.1v or v cc ? 0.1v |i out | 20 a 2.0 3.0 4.5 6.0 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 0.50 0.90 1.35 1.80 v v oh minimum high ? level output voltage v in = v ih or v il |i out | 20 a 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 v v in =v ih or v il |i out | 2.4ma |i out | 4.0ma |i out | 5.2ma 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 v ol maximum low ? level output voltage v in = v ih or v il |i out | 20 a 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high ? impedance cir- cuit. for proper operation, v in and v out should be constrained to the range gnd (v in or v out ) v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc74hc4040a http://onsemi.com 4 dc characteristics (voltages referenced to gnd) symbol unit guaranteed limit v cc v condition parameter symbol unit 125 c 85 c ? 55 to 25 c v cc v condition parameter v in = v ih or v il |i out | 2.4ma |i out | 4.0ma |i out | 5.2ma 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.40 0.40 0.40 i in maximum input leakage current v in = v cc or gnd 6.0 0.1 1.0 1.0 a i cc maximum quiescent supply current (per package) v in = v cc or gnd i out = 0 a 6.0 4 40 160 a ac characteristics (c l = 50 pf, input t r = t f = 6 ns) symbol parameter v cc v guaranteed limit unit ? 55 to 25 c 85 c 125 c f max maximum clock frequency (50% duty cycle) (figures 1 and 4) 2.0 3.0 4.5 6.0 10 15 30 50 9.0 14 28 45 8.0 12 25 40 mhz t plh , t phl maximum propagation delay, clock to q1* (figures 1 and 4) 2.0 3.0 4.5 6.0 96 63 31 25 106 71 36 30 115 88 40 35 ns t phl maximum propagation delay, reset to any q (figures 2 and 4) 2.0 3.0 4.5 6.0 65 30 30 26 72 36 35 32 90 40 40 35 ns t plh , t phl maximum propagation delay, qn to qn+1 (figures 3 and 4) 2.0 3.0 4.5 6.0 69 40 17 14 80 45 21 15 90 50 28 22 ns t tlh , t thl maximum output transition time, any output (figures 1 and 4) 2.0 3.0 4.5 6.0 75 27 15 13 95 32 19 15 110 36 22 19 ns c in maximum input capacitance 10 10 10 pf * for t a = 25 c and c l = 50 pf, typical propagation delay from clock to other q outputs may be calculated with the following equations: v cc = 2.0 v: t p = [93.7 + 59.3 (n ? 1)] ns v cc = 4.5 v: t p = [30.25 + 14.6 (n ? 1)] ns v cc = 3.0 v: t p = [61.5 + 34.4 (n ? 1)] ns v cc = 6.0v: t p = [24.4 + 12 (n ? 1)] ns c pd power dissipation capacitance (per package)* typical @ 25 c, v cc = 5.0 v pf 31 * used to determine the no ? load dynamic power consumption: p d = c pd v cc 2 f + i cc v cc .
mc74hc4040a http://onsemi.com 5 timing requirements (input t r = t f = 6 ns) symbol parameter v cc v guaranteed limit unit ? 55 to 25 c 85 c 125 c t rec minimum recovery time, reset inactive to clock (figure 2) 2.0 3.0 4.5 6.0 30 20 5 4 40 25 8 6 50 30 12 9 ns t w minimum pulse width, clock (figure 1) 2.0 3.0 4.5 6.0 70 40 15 13 80 45 19 16 90 50 24 20 ns t w minimum pulse width, reset (figure 2) 2.0 3.0 4.5 6.0 70 40 15 13 80 45 19 16 90 50 24 20 ns t r , t f maximum input rise and fall times (figure 1) 2.0 3.0 4.5 6.0 1000 800 500 400 1000 800 500 400 1000 800 500 400 ns pin descriptions inputs clock (pin 10) negative ? edge triggering clock input. a high ? to ? low transition on this input advances the state of the counter. reset (pin 11) active ? high reset. a high level applied to this input asynchronously resets the counter to its zero state, thus forcing all q outputs low. outputs q1 thru q12 (pins 9, 7, 6, 5, 3, 2, 4, 13, 12, 14, 15, 1) active ? high outputs. each qn output divides the clock input frequency by 2 n . switching waveforms t f clock q1 v cc gnd 90% 50% 10% t r t w 90% 50% 10% t phl 1/f max t plh t tlh t thl clock v cc gnd t w t rec 50% figure 3. reset v cc gnd 50% any q 50% t phl figure 4.
mc74hc4040a http://onsemi.com 6 switching waveforms (continued) 50% qn v cc gnd 50% qn+1 c l * *includes all probe and jig capacitance test point device under test output figure 5. figure 6. test circuit t plh t phl figure 7. expanded logic diagram clock 10 c c r reset 11 q q c c r q q q1 9 c c q q c c q q c c q q c c q q2 7 q3 6 q10 14 q11 15 q12 1 q4 = pin 5 q5 = pin 3 q6 = pin 2 q7 = pin 4 q8 = pin 13 q9 = pin 12 v cc = pin 16 gnd = pin 8
mc74hc4040a http://onsemi.com 7 clock reset q1 1 2 4 8 16 32 64 128 256 512 1024 2048 4096 q2 q3 q4 q5 q6 q7 q8 q10 q11 figure 8. timing diagram q9 q12 applications information time ? base generator a 60hz sinewave obtained through a 100 k resistor connected to a 120 vac power line through a step down transformer is applied to the input of the mc54/74hc14a, schmitt-trigger inverter. the hc14a squares ? up the input waveform and feeds the hc4040a. selecting outputs q5, q10, q11, and q12 causes a reset every 3600 clocks. the hc20 decodes the counter outputs, produces a single (narrow) output pulse, and resets the binary counter. the resulting output frequency is 1.0 pulse/minute. hc4040a figure 9. time ? base generator clock q5 q10 q11 q12 v cc 13 12 10 9 1 2 4 5 8 1/2 hc20 1/2 hc20 6 1.0 pulse/minute output 20pf 1.0m 120vac 60hz note: ground must be isolated by a transformer or opto ? isolator for safety reasons.
mc74hc4040a http://onsemi.com 8 package dimensions pdip ? 16 n suffix case 648 ? 08 issue t notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. ? a ? b f c s h g d j l m 16 pl seating 18 9 16 k plane ? t ? m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01
mc74hc4040a http://onsemi.com 9 package dimensions soic ? 16 case 751b ? 05 issue k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p ? b ? ? a ? m 0.25 (0.010) b s ? t ? d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 6.40 16x 0.58 16x 1.12 1.27 dimensions: millimeters 1 pitch soldering footprint* 16 89 8x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hc4040a http://onsemi.com 10 package dimensions tssop ? 16 dt suffix case 948f ? 01 issue b ??? ??? ??? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ? w ? . section n ? n seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g ? u ? s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) ? t ? ? v ? ? w ? 0.25 (0.010) 16x ref k n n 7.06 16x 0.36 16x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hc4040a http://onsemi.com 11 package dimensions soeiaj ? 16 f suffix case 966 ? 01 issue a h e a 1 dim min max min max inches --- 2.05 --- 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.007 0.011 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 --- 0.78 --- 0.031 a 1 h e q 1 l e 10 0 10 l e q 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4. terminal numbers are shown for reference only. 5. the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). m l detail p view p c a b e m 0.13 (0.005) 0.10 (0.004) 1 16 9 8 d z e a b c d e e l m z on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. mc74hc4040a/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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